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Failure Analysis Of Printed Circuit Board

One (1) PCB was received following wave soldering, with multiple delaminations. The board had been in storage for several months and processed without prebake.

Board dissection revealed what appears to be a lack of either pressure or temperature during the manufacturer's lamination/press process, resulting in areas where thermosetting resin in the prepreg did not undergo molecular cross-linking (the prepreg did not gel properly as to allow interlayer bonding). This is a manufacturing induced defect (laminating process problem) and not the result of board application.


Overall optical view of the board (side 1) showing the delamination location.

 

Detailed optical view of the board (side 1) showing the delamination.

 

Overall optical view of the board (side 2) showing the delamination location.

 

Detailed optical view of the board (side 2) showing the delamination.

 

Detailed optical view of the dissected board showing the internal face of the delamination.

 

Detailed optical view of the dissected board showing the internal face of the delamination.

 

 

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