Assurance Technology Corporation provides engineering, electronics and PCB design, research and development, project management, failure analysis, reliability predictions, and parts production.

 

Failure Analysis Of Printed Wiring Board

Three (3) devices were removed from each of two (2) boards. The components are designated as U21, U52 and U60 (ref. the overall optical view below). The devices were then radiographically examined (2 views) for defects that would induce an intermittent open circuit condition. Overall top and side views of typical devices are also provided below.

No anomalous conditions were detected that would result in the reported failure mode. Scanning Acoustic Microscopy (SAM) revealed significant disbonding on board 045, device U21, U52 and U60, and board 311 device U60. The disbonding is believed to be severe enough to have lifted internal wire bonds at the die. SAM scans are presented below. The remaining devices from board 311 appear to be free of disbonding.


Overall optical view of PWB showing the components to be analyzed.

 

Top radiographic view of a typical U21.

 

Top radiographic view of a typical U52.

 

Top radiographic view of a typical U60.

 

Radiographic side view of a typical U21.

 

Radiographic side view of a typical U52.

 

Radiographic side view of a typical U60.

 

SAM results, showing disbonding in red.

 

SAM results, showing disbonding in red.

 

 

Home - Overview - Systems & Products - Services - Contacts
Careers - In The News - Links - ISO/AS Cert. - Blanket Purchase Agreements

© 2008 Assurance Technology Corporation.   All rights reserved.
Please report problems to the webmaster.